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Silver conductive epoxy meets NASA low outgassing standards

Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries.

The adhesive cures at room temperature in 24-48 hours and in just 1-2 hrs at 200ºF, producing tough high strength bonds. It features a tensile shear strength of more than 1,800 psi, a T-peel of greater than 5 pli, and outstanding adhesion to similar and dissimilar substrates. The volume resistivity of the system is less than 10-3 ohm-cm. Serviceable over the exceptionally wide range of 4K to 275ºF, EP21TDCS-LO is suitable for cryogenic applications. It withstands thermal cycling and is resistant to chemicals, including water, oil and most organic solvents.

The epoxy offers a simple 1 to 1 mixing ratio by weight or volume. With its low drip formula, EP21TDCS-LO can be conveniently applied with a syringe, knife, spatula or trowel to vertical surfaces without sagging and only contact pressure is required for curing. Syringes have a 3 month shelf life and glass jars have a 6 month shelf life, if stored at room temperature. EP21TDCS-LO is available in premixed and frozen syringes, as well as in metal containers.

Press release issued by Master Bond Inc. on February 8, 2011


 Contact details from our directory:
Master Bond Inc. Electronic Circuitry Conformal Coatings, Adhesives, Conductive Adhesive, Epoxy Adhesive, Fire Resistant Adhesive, Glass-to-Metal Adhesive, Metal-to-Metal Adhesive, Optical Adhesive, Pressure-Sensitive Adhesive, Rubber Adhesive, Silicone Adhesive, Potting Compounds, Thread Locking Compounds, Fuel Tank Sealants, Coatings, Chemical Agent Resistant Coatings


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