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Microsemi announces two new versions of its high power TVS Devices to address demanding lightning protection requirements in aircraft

Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of two new versions of its transient voltage suppressor (TVS) devices in its patented plastic large area device (PLAD) package. The 18-kilowatt (kW) MPLAD18KP and 36-kW MPLAD36KP TVS families meet today's demanding lightning protection requirements in aircraft, including the multi-strike lightning standard (RTCA DO-160E), which have grown in importance as a result of the introduction and growing use of composite body airframes.

Microsemi's new products are high power TVS devices in low-profile surface-mount packages with design features to minimize thermal resistance and cumulative heating. Microsemi's unique plastic large area device (PLAD) technology enables more effective surface-mount TVS packaging for the MPLAD18KP and MPLAD36KP, as it combines a large die size with an exposed bottom contact for heat sinking that improves power handling as compared to through-hole devices. In addition, the devices provide the capability of a bond wire-free part in high vibration environments, supporting high reliability in harsh conditions.

"Our new high power TVS devices are critical for addressing multiple-stroke and multiple-burst events on aircraft, and leverage our team's deep expertise in this important area of protection for customers," said Christophe Warin, director of strategic marketing for Microsemi. "In addition to enabling these customers to meet the rigorous RTCA DO-160 section 22 standard for aircraft design, the MPLAD18KP and MPLAD36KP TVS families offer an efficient low-profile package design in standoff voltage selections of 14 volts (V) to 40 V in either unidirectional or bidirectional construction."

The 18-kW MPLAD18KP and 36-kW MPLAD36KP TVS devices are designed for a variety of applications within the aerospace market, including engine control units, actuator controls, power distribution, power density improvements, environmental controls, communications and instrumental systems. These TVS products, together with the recently launched aerospace power core module with integrated field programmable gate array (FPGA) and hybrid power drive, form an integral part of the power drive electronics architecture on more electric aircraft. The release of these products further emphasizes Microsemi's continued development in intelligent power solutions to meet the demand for increased levels of reliability and integration in the area of power electronics.

The two new devices are complementary to Microsemi's transient voltage suppressor portfolio for avionics that features low capacitance TVS, standard unidirectional and bidirectional TVS (surface mount and through-hole), TVS array and low capacitance TVS array solutions. In addition, the MPLAD18KP and MPLAD36KP lightning and automotive load dump protection allow their utilization in applications serving the automotive and defense markets, as they can provide a wide range of suppression capability for varying threat requirements either in a single or multiple devices.

With aircraft electrification continuing to increase, Microsemi's new devices are ideal to capitalize on this market growth. According to market research firm Markets and Markets, the global power surge protection device market is expected to grow from an estimated $2 billion in 2014 to $2.7 billion by 2019, at a compound annual growth rate (CAGR) of 5.3 percent from 2014 to 2019. Addressing these growing trends, Microsemi's new TVS devices offer protection from switching transients and induced radio frequency interference (RFI), with the ability to suppress transients up to 36,000 watts at 10/1,000 μs. Offering the high reliability necessary for the demands of this market, all parts are surge tested and available with various screening and conformance inspection options.

Additional key features include:

Wafer fabrication and assembly lot traceability

Optional upscreening available

Moisture classification of Level 1 with no dry pack required per IPC/JEDEC J-STD-020B

RoHS compliant versions available

3σ lot norm screening performed on standby current (ID)

Lower voltage converter versus axial

Large die and excellent die to base connection

No wire bonds

Tested in accordance with the Automotive Electronics Council (AEC) Q101 stress test

Press release issued by Microsemi Corporation on January 4, 2017

 

 Contact details from our directory:
Microsemi Corporation Electronic Components, Semiconductor Components, Solid State Circuitry

 

 Related directory sectors:
Active Electronic Components

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