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Firan Technology Group Corporation (FTG) builds on competitive advantage through new production technology

Firan Technology Group Corporation (FTG) today announced that it has installed a Laser Direct Imaging (LDI) system in its FTG Circuits - Toronto facility. The system will enable FTG to increase its capabilities to produce high density interconnect (HDI) products, which will further enhance its competitive advantage in its current printed circuit board (PCB) business lines, as well as create opportunities for FTG to bid on new programs in the aerospace and defense markets.

FTG purchased the Paragon 8000 system from Orbotech Ltd., a global leader in advanced production technology, building on the long-term relationship between the two companies. The Paragon 8000 is cutting-edge technology that only a few North American PCB manufacturers possess. With imaging resolution down to 0.000125", the technology enables FTG to increase its capabilities to produce circuit boards with finer lines and spaces, which in turn allows customers to reduce the size and weight of electronics packages for their programs. Additionally, with its automated alignment features, the equipment will improve FTG's ability to accurately register circuitry images with drilled holes and other features and optimize its production processes by eliminating a number of manufacturing steps thereby improving cycle times for new products.

"FTG continues to invest across its businesses to provide the highest level of technology to our aerospace and defense customers", stated Brad Bourne, President and CEO, FTG Corporation. He added, "This equipment is an important investment in support of our efforts to provide HDI capabilities to our customers. As well, the systems will positively impact our margins through more efficient operations and allowing us to bid on more technically advanced programs."

Press release issued by FTG Circuits on January 27, 2009

 

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FTG Circuits Printed Circuit Boards

 

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Active Electronic Components

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