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ADLINK Technology revolutionizes rugged small form factor (SFF) computing with the CoreModule® 730 SBC

ADLINK Technology Inc.(TAIEX:6166), a leading global provider of trusted embedded products, today announced the biggest architectural innovation in small form factor (SFF) rugged single board computers (SBCs) since the PC/104 bus was invented by Ampro in 1992. The new CoreModule® 730 embedded processor, based on the ultra low power Intel® Atom™ Z510 and Z530 processors at 1.1 and 1.6 GHz, respectively, sets a new efficiency standard for tiny rugged computers by using the new SUMIT™ expansion interface. It reinvents stackable and mezzanine architectures by packing an enormous amount of data bandwidth and easy connectivity – including multiple PCI Express® lanes, USB 2.0 interfaces, LPC bus, I2C bus, and SPI bus – into a fraction of the space previously occupied by only the 33 MHz parallel PCI-104 bus.

With PCI Express, Gigabit Ethernet, USB 2.0 ports, and a CompactFlash® socket, the CoreModule® 730 features the lowest power Intel chipset available, the US15W, to complement the Intel® Atom™ processor for a total power consumption of only 5 watts. Conductive cooling solutions are also easy to implement for small sealed boxes with no internal air flow. The release of the CoreModule® 730 means that system OEMs in military, avionics, transportation, data logging, portable computing and other rugged markets can add a state-of-the-art Intel® Architecture controller to their systems without a custom carrier board design.

"While many board manufacturers require their system OEM customers to design custom carriers or use two-board solutions in order to take advantage of their Atom-based computer-on-module (COM) products, ADLINK offers CoreModule® 730 as a true single-board solution, ready to run with simple cables," said Colin McCracken, product director for ADLINK's embedded computer division. "By departing from space-inefficient pin-in-socket expansion with parallel buses, CoreModule® 730 will bring stackable SBCs into new application areas. Even after the merger, ADLINK continues to build upon Ampro's reputation and tradition of pioneering modular small form factor technologies for high-reliability and long lifecycle embedded markets."

About the CoreModule® 730 The CoreModule® 730 is the first SUMIT-ISM™ product on the market. SUMIT™ is the new standard expansion interface from the Small Form Factor Special Interest Group (SFF-SIG), www.sff-sig.org. ISM™ stands for Industry Standard Module, and is a 90x96mm form factor that specifies a board outline and mounting holes and is completely flexible in terms of expansion interfaces. ISM™ is also defined by the SFF-SIG. The CoreModule® 730 offers a choice of 1.1 GHz and 1.6 GHz Atom™ processors, US15W chipset, DDR2 533 SODIMM RAM up to 2 GB, Gigabit Ethernet, four USB 2.0 ports, IDE interface, CompactFlash socket, 8 general-purpose I/O pins (GPIOs), and integrated graphics engine with H.264 decode acceleration, analog VGA output and 18-bit / 24-bit LVDS interface for LCD displays.

Press release issued by ADLINK Technology on June 22, 2009


 Contact details from our directory:
ADLINK Technology Test Equipment, Data Bus, Electronic Components


 Related directory sectors:
Passive Electronic Components
Active Electronic Components

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