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Master Bond EP3SP5FL is a moderate viscosity, snap cure epoxy that features the ability to be reworked

One component, snap cure epoxy features high strength properties

Suitable for a variety of applications in the electronic, aerospace and OEM industries, Master Bond EP3SP5FL is a single component epoxy that cures in 1-2 minutes at 300°F. Since it requires heat curing, it essentially has “unlimited” working life at room temperature.

With a flowable, moderate viscosity, EP3SP5FL adheres well to a variety of substrates including metals, composites, glass, ceramics, many rubbers and plastics. It has a high tensile lap shear strength exceeding 2,000 psi at room temperature when bonding aluminum to aluminum. EP3SP5FL is an effective electrical insulator and it withstands thermal cycling, impact and shock. It also resists water, oils, fuels and has low shrinkage upon curing.

The service temperature range for this system is -60°F to +200°F. At ambient temperatures, EP3SP5FL has a hardness greater than 85 Shore D, but it softens above 200°F to 25-30 Shore D. This characteristic can allow the epoxy to be more readily reworkable than most other epoxy systems.

EP3SP5FL is available in syringes, ½ pints, pints and quarts containers. It has a minimum shelf life of 3 months and a maximum of 6 months in its original, unopened containers.

Press release issued by Master Bond Inc. on August 4, 2014


 Contact details from our directory:
Master Bond Inc. Electronic Circuitry Conformal Coatings, Adhesives, Conductive Adhesive, Epoxy Adhesive, Fire Resistant Adhesive, Glass-to-Metal Adhesive, Metal-to-Metal Adhesive, Optical Adhesive, Pressure-Sensitive Adhesive, Rubber Adhesive, Silicone Adhesive, Potting Compounds, Thread Locking Compounds, Fuel Tank Sealants, Coatings, Chemical Agent Resistant Coatings


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