The Airframer Bulletin

Teledyne HiRel Electronics (e2v)

All news ✕ Clear ‹ Current edition

Every Bulletin story and press release covering Teledyne HiRel Electronics (e2v), newest first.

5 items

2026

2 September

ReleaseEverspin Technologies and Teledyne HiRel Semiconductors partner to accelerate MRAM adoption in aerospace and defense applications

19 February

ReleaseTeledyne HiRel Semiconductors unveils industry’s lowest power, 4 GHz, wideband low‑noise amplifier (LNA)

2025

7 August

ReleaseTeledyne HiRel Semiconductors launches eMMC 5.1 module

24 July

ReleaseTeledyne HiRel Semiconductors announces high-density 16 GByte DDR4 module

9 January

ReleaseTeledyne HiRel Semiconductors releases high-power RF GaN switch (30 MHz to 5 GHz)