TTM Technologies, Inc., a leading U.S. manufacturer of advanced electronics and interconnect solutions for aerospace, defence, and high-technology markets, today celebrated the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (Ultra-HDI) printed circuit board (PCB) manufacturing facility in Syracuse, New York, marking a significant investment in domestic defence electronics manufacturing.

The new facility, spanning 215,000 square feet on TTM's existing Syracuse campus, is among the first in the nation to be purpose-built for Ultra-HDI PCB and advanced packaging production, serving aerospace and defence programmes. The investment will create up to 400 new engineering and manufacturing jobs, bringing TTM's total Central New York workforce to approximately 1,000 employees, further strengthening the region's position as one of America's premier hubs for advanced microelectronics manufacturing.

"This is more than a facility, it is a statement about where American defence manufacturing is headed," said Cathie Gridley, EVP and President of Aerospace & Defence at TTM Technologies. "Our defence customers need trusted, domestic, ultra-high-density interconnect production capability that meets the most demanding programme requirements in the world. Today, we bring that capability to the United States. This investment strengthens the U.S. microelectronics supply chain, deepens our commitment to Central New York, and positions TTM to support the next generation of defence and national security technologies for decades to come."

The Syracuse facility directly addresses a critical gap in the U.S. defence industrial base. Ultra-HDI PCBs, which enable unprecedented miniaturisation and performance density in advanced electronics, are essential to next-generation defence platforms, including radar systems, missile defence architectures, space-based sensors, and autonomous systems. Until now, domestic production capacity for these advanced board technologies has been severely limited, with the majority of global manufacturing concentrated in Asia.

Contributing to the total investment in Syracuse, the project received a $30 million investment from the U.S. Department of War, recognising the facility's strategic importance to national security and the alignment with the domestic microelectronics revival.

First announced in November 2023 and celebrated with a beam-signing ceremony attended by Governor Kathy Hochul in October 2024, the facility builds on TTM's more than 60-year manufacturing presence in Syracuse and its longstanding role as a trusted partner to the nation's aerospace and defence industrial base.