The Advanced Circuit Materials (ACM) Division of Rogers Corporation introduced its latest patent-pending innovation in high frequency materials, RT/duroid® 5880LZ laminate.

RT/duroid 5880LZ materials tout the lowest Dk for a copper clad laminate available in the market today, providing improved antenna efficiency. It is a lightweight, PTFE-based composite optimized with a unique filler that provides very low density (1.37 gm/cm3)and a low coefficient of thermal expansion (CTE) in the z-axis. This makes 5880LZ well suited for fabricating high-frequency circuits with plated through holes (PTHs) and allows higher vehicle payloads. With an exceptional TCDK (thermal coefficient of dielectric constant) of 22 PPM/°C, 5880LZ enables consistent circuit performance and stable dielectric constant versus temperature.

Rogers' 5880LZ laminate materials are made using the same high quality, reliable materials and processes that Rogers' pioneered and that enable Rogers to consistently achieve top awards from the largest manufacturers and fabricators of high frequency materials in the world. Because of its low dielectric constant of 1.96, RT/duroid 5880LZ supports broadband applications at the microwave through millimeter-wave frequencies where dispersion and circuit losses must be minimized.

5880LZ delivers consistent performance across each board and from panel to panel for critical amplitude- and phase-matched applications. The easy-to-machine material can be supplied as a laminate with a variety of electrodeposited copper weights and with a variety of dielectric thicknesses.