Heat sinks are passive thermal management devices used in aerospace electronic assemblies to dissipate heat generated by active components such as power transistors, thyristors, and integrated circuits, maintaining junction temperatures within qualified limits. They are manufactured from high-conductivity materials including aluminium alloy, copper, and beryllium oxide, employing extrusion, skiving, or additive manufacturing processes, and may incorporate thermal interface materials (TIMs), heat pipes, or vapour-chamber technology to meet MIL-spec thermal performance requirements.
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