Heat sinks are passive thermal management devices used in aerospace electronic assemblies to dissipate heat generated by active components such as power transistors, thyristors, and integrated circuits, maintaining junction temperatures within qualified limits. They are manufactured from high-conductivity materials including aluminium alloy, copper, and beryllium oxide, employing extrusion, skiving, or additive manufacturing processes, and may incorporate thermal interface materials (TIMs), heat pipes, or vapour-chamber technology to meet MIL-spec thermal performance requirements.
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Heat Sinks suppliers linked to most aircraft programs in our database.
Latest Airframer news and company press releases
| 27/07/2026 | Press Release: Mobix Labs to become NSM Labs, advancing a national security platform for America and its allies |
| 24/06/2026 | NEWS: Mobix Labs relocates EMI operations to larger Irvine facility |
| 22/06/2026 | Press Release: TTM Technologies opens Ultra-HDI manufacturing facility in Syracuse, NY, advancing America's defence electronics industrial base |
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